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	<title>PR Hub &#187; R.o.c.</title>
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	<link>http://blog.taragana.com/pr</link>
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	<pubDate>Tue, 23 Feb 2010 08:06:57 +0000</pubDate>
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		<title>Dialog Semiconductor and TSMC Collaborate on Industry-Leading BCD Process for Power Management ICs</title>
		<link>http://blog.taragana.com/pr/dialog-semiconductor-and-tsmc-collaborate-on-industry-leading-bcd-process-for-power-management-ics-13608/</link>
		<comments>http://blog.taragana.com/pr/dialog-semiconductor-and-tsmc-collaborate-on-industry-leading-bcd-process-for-power-management-ics-13608/#comments</comments>
		<pubDate>Tue, 23 Feb 2010 05:00:00 +0000</pubDate>
		<dc:creator>Tsmc</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[Licensing / Marketing Agreements]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[February 23]]></category>

		<category><![CDATA[Germany]]></category>

		<category><![CDATA[Germany And Hsinchu]]></category>

		<category><![CDATA[Kirchheim/teck]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/dialog-semiconductor-and-tsmc-collaborate-on-industry-leading-bcd-process-for-power-management-ics-13608/</guid>
		<description><![CDATA[Dialog raises level of power management integration to address needs of future portable devices such as smartphones, ebooks, netbooks

KIRCHHEIM/TECK, Germany and HSINCHU, Taiwan, R.O.C., February 23, 2010  - Dialog Semiconductor plc (FWB: DLG), a leading provider of highly
integrated innovative power management semiconductor solutions, today
announced that the company is working closely with foundry partner Taiwan
Semiconductor [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/dialog-semiconductor-and-tsmc-collaborate-on-industry-leading-bcd-process-for-power-management-ics-13608/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC to Take Delivery of an ASML EUV Lithography System for Research and Development on Future Technology Generations</title>
		<link>http://blog.taragana.com/pr/tsmc-to-take-delivery-of-an-asml-euv-lithography-system-for-research-and-development-on-future-technology-generations-13526/</link>
		<comments>http://blog.taragana.com/pr/tsmc-to-take-delivery-of-an-asml-euv-lithography-system-for-research-and-development-on-future-technology-generations-13526/#comments</comments>
		<pubDate>Sun, 21 Feb 2010 05:00:00 +0000</pubDate>
		<dc:creator>Tsmc</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[Nanotechnology]]></category>

		<category><![CDATA[New Products / Services]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[February 22]]></category>

		<category><![CDATA[Netherlands and hsinchu]]></category>

		<category><![CDATA[Netherlands Antil]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<category><![CDATA[Veldhoven]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-to-take-delivery-of-an-asml-euv-lithography-system-for-research-and-development-on-future-technology-generations-13526/</guid>
		<description><![CDATA[Agreement underscores TSMC&apos;s continuing investment in the European semiconductor community

VELDHOVEN, Netherlands and HSINCHU, Taiwan, R.O.C., February 22, 2010  - ASML Holding NV (ASML) today announced that Taiwan Semiconductor
Manufacturing Company (TWSE: 2330, NYSE: TSM) will take delivery of a
TWINSCAN NXE:3100 extreme ultra-violet (EUV) lithography system. This tool
represents one of six NXE:3100 EUV systems for ASML&#39;s [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-to-take-delivery-of-an-asml-euv-lithography-system-for-research-and-development-on-future-technology-generations-13526/feed/</wfw:commentRss>
		</item>
		<item>
		<title>Qualcomm and TSMC Collaborating on 28nm Process Technology</title>
		<link>http://blog.taragana.com/pr/qualcomm-and-tsmc-collaborating-on-28nm-process-technology-11388/</link>
		<comments>http://blog.taragana.com/pr/qualcomm-and-tsmc-collaborating-on-28nm-process-technology-11388/#comments</comments>
		<pubDate>Fri, 08 Jan 2010 05:00:00 +0000</pubDate>
		<dc:creator>Tsmc Qualcomm Incorporated</dc:creator>
		
		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[Investors]]></category>

		<category><![CDATA[Joint Ventures]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Wireless Communications]]></category>

		<category><![CDATA[california]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[San Diego And Hsinchu]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[Tsmc; Qualcomm Incorporated]]></category>

		<category><![CDATA[Twitter]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/qualcomm-and-tsmc-collaborating-on-28nm-process-technology-11388/</guid>
		<description><![CDATA[Cutting-edge Semiconductor Technology Enables Mobile Devices to Offer Greater Functionality and Lower Power Consumption -

SAN DIEGO and HSINCHU, TAIWAN, R.O.C., January 8  - Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator
of advanced wireless technologies, products and services, today announced
that the Company is working closely with foundry partner Taiwan Semiconductor
Manufacturing Company (TWSE: 2330, NYSE: [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/qualcomm-and-tsmc-collaborating-on-28nm-process-technology-11388/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC Announces Process Technologies for Integrated LED Drivers</title>
		<link>http://blog.taragana.com/pr/tsmc-announces-process-technologies-for-integrated-led-drivers-10661/</link>
		<comments>http://blog.taragana.com/pr/tsmc-announces-process-technologies-for-integrated-led-drivers-10661/#comments</comments>
		<pubDate>Tue, 15 Dec 2009 05:00:00 +0000</pubDate>
		<dc:creator>Tsmc</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[New Products / Services]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

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		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-announces-process-technologies-for-integrated-led-drivers-10661/</guid>
		<description><![CDATA[Integration Features Lowers Overall Systems Component Counts
HSINCHU, Taiwan, R.O.C., December 15  - Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM)
today unveiled modular BCD (Bipolar, CMOS DMOS) process technologies
targeting high voltage integrated LED driver devices.

    The new BCD technologies feature a voltage spectrum running from 12 to 60
volts to support multiple [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-announces-process-technologies-for-integrated-led-drivers-10661/feed/</wfw:commentRss>
		</item>
		<item>
		<title>Additional Detail Regarding TSMC Expects Next Year to be a Record Year</title>
		<link>http://blog.taragana.com/pr/additional-detail-regarding-tsmc-expects-next-year-to-be-a-record-year-8285/</link>
		<comments>http://blog.taragana.com/pr/additional-detail-regarding-tsmc-expects-next-year-to-be-a-record-year-8285/#comments</comments>
		<pubDate>Fri, 30 Oct 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[Earnings Projections / Forecasts]]></category>

		<category><![CDATA[Investors]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/additional-detail-regarding-tsmc-expects-next-year-to-be-a-record-year-8285/</guid>
		<description><![CDATA[HSINCHU, Taiwan, R.O.C. - 
At TSMC&#8217;s third quarter investors&#8217; conference on October 29, TSMC Chairman Dr. Morris Chang commented that &#8220;For TSMC, we expect next year to be a record year.&#8221; TSMC Spokesperson and Chief Financial Officer Ms. Lora Ho provides additional detail regarding this statement.

&#8220;Setting a record year in 2010 is TSMC&#8217;s internal target [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/additional-detail-regarding-tsmc-expects-next-year-to-be-a-record-year-8285/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC Adds High-K Metal Gate Low Power Process to 28nm Road Map</title>
		<link>http://blog.taragana.com/pr/tsmc-adds-high-k-metal-gate-low-power-process-to-28nm-road-map-5090/</link>
		<comments>http://blog.taragana.com/pr/tsmc-adds-high-k-metal-gate-low-power-process-to-28nm-road-map-5090/#comments</comments>
		<pubDate>Mon, 24 Aug 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[New Products / Services]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-adds-high-k-metal-gate-low-power-process-to-28nm-road-map-5090/</guid>
		<description><![CDATA[HSINCHU, Taiwan, R.O.C. - 
- Risk production expected in Q3 2010
Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that it is adding a low power process to its 28nm high-k metal gate (HKMG) road map. The new process is expected to enter risk production in the third quarter of 2010.

TSMC&#8217;s 28nm development [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-adds-high-k-metal-gate-low-power-process-to-28nm-road-map-5090/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC Achieves 28nm SRAM Yield Breakthrough</title>
		<link>http://blog.taragana.com/pr/tsmc-achieves-28nm-sram-yield-breakthrough-5093/</link>
		<comments>http://blog.taragana.com/pr/tsmc-achieves-28nm-sram-yield-breakthrough-5093/#comments</comments>
		<pubDate>Mon, 24 Aug 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-achieves-28nm-sram-yield-breakthrough-5093/</guid>
		<description><![CDATA[HSINCHU, Taiwan, R.O.C. - 
- Key process development achievement demonstrates gate-last approach manufacturing benefits

Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) has become the first foundry not only to achieve 28nm functional 64Mb SRAM yield, but also to achieve it across all three 28nm nodes.
&#8220;Achieving 64Mb SRAM yield across all three 28nm process nodes [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-achieves-28nm-sram-yield-breakthrough-5093/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC Launches Unified Physical Verification Format for Advanced Process Technologies</title>
		<link>http://blog.taragana.com/pr/tsmc-launches-unified-physical-verification-format-for-advanced-process-technologies-4273/</link>
		<comments>http://blog.taragana.com/pr/tsmc-launches-unified-physical-verification-format-for-advanced-process-technologies-4273/#comments</comments>
		<pubDate>Tue, 21 Jul 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[New Products / Services]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-launches-unified-physical-verification-format-for-advanced-process-technologies-4273/</guid>
		<description><![CDATA[HSINCHU, Taiwan, R.O.C. - 
- New iDRC and iLVS Data Formats Ensure Data Accuracy and Enable Extensive EDA Support of Physical Verification Related Applications in TSMC 40nm Process

Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today unveiled interoperable design rule check (iDRC) and layout-versus-schematic (iLVS), two unified electronic design automation (EDA) data formats, for [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-launches-unified-physical-verification-format-for-advanced-process-technologies-4273/feed/</wfw:commentRss>
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		<item>
		<title>TSMC Launches First Advanced Technology Interoperable Process Design Kit</title>
		<link>http://blog.taragana.com/pr/tsmc-launches-first-advanced-technology-interoperable-process-design-kit-4275/</link>
		<comments>http://blog.taragana.com/pr/tsmc-launches-first-advanced-technology-interoperable-process-design-kit-4275/#comments</comments>
		<pubDate>Tue, 21 Jul 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[New Products / Services]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[China]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-launches-first-advanced-technology-interoperable-process-design-kit-4275/</guid>
		<description><![CDATA[HSINCHU, Taiwan, R.O.C. - 
- Industry-Wide Collaborative Development Effort Delivers First Unified iPDK for 65nm Process

Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced the release of the semiconductor industry&#8217;s first interoperable process design kit (iPDK) for advanced technology. The kit is fully validated on TSMC&#8217;s 65 nanometer (nm) process and represents the [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-launches-first-advanced-technology-interoperable-process-design-kit-4275/feed/</wfw:commentRss>
		</item>
		<item>
		<title>NetLogic Microsystems and TSMC Collaborate on Industry-Leading 40nm Technology for Next-Generation Knowledge-based Processors and 10/40/100 Gigabit Physical Layer Solutions</title>
		<link>http://blog.taragana.com/pr/netlogic-microsystems-and-tsmc-collaborate-on-industry-leading-40nm-technology-for-next-generation-knowledge-based-processors-and-1040100-gigabit-physical-layer-solutions-4145/</link>
		<comments>http://blog.taragana.com/pr/netlogic-microsystems-and-tsmc-collaborate-on-industry-leading-40nm-technology-for-next-generation-knowledge-based-processors-and-1040100-gigabit-physical-layer-solutions-4145/#comments</comments>
		<pubDate>Wed, 15 Jul 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[Investors]]></category>

		<category><![CDATA[Joint Ventures]]></category>

		<category><![CDATA[New Products / Services]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[california]]></category>

		<category><![CDATA[Californiahsinchu]]></category>

		<category><![CDATA[Mountain view]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

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		<guid isPermaLink="false">http://blog.taragana.com/pr/netlogic-microsystems-and-tsmc-collaborate-on-industry-leading-40nm-technology-for-next-generation-knowledge-based-processors-and-1040100-gigabit-physical-layer-solutions-4145/</guid>
		<description><![CDATA[MOUNTAIN VIEW, California and HSINCHU, Taiwan, R.O.C. - 
- NetLogic Microsystems Successfully Migrates Multiple Product Lines to TSMC&#8217;s Advanced 40nm Technology Node to offer customers significantly higher performance, lower power consumption and advanced features that enable next-generation networking, communications, data center, security and storage applications

NetLogic Microsystems, Inc. [Nasdaq: NETL], a leader in the design and [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/netlogic-microsystems-and-tsmc-collaborate-on-industry-leading-40nm-technology-for-next-generation-knowledge-based-processors-and-1040100-gigabit-physical-layer-solutions-4145/feed/</wfw:commentRss>
		</item>
		<item>
		<title>NXP and TSMC Deliver Industry&#8217;s First 45nm Single-Chip Digital TV Platform</title>
		<link>http://blog.taragana.com/pr/nxp-and-tsmc-deliver-industrys-first-45nm-single-chip-digital-tv-platform-3976/</link>
		<comments>http://blog.taragana.com/pr/nxp-and-tsmc-deliver-industrys-first-45nm-single-chip-digital-tv-platform-3976/#comments</comments>
		<pubDate>Thu, 09 Jul 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[New Products / Services]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Eindhoven]]></category>

		<category><![CDATA[Netherlands]]></category>

		<category><![CDATA[Netherlands and hsinchu]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/nxp-and-tsmc-deliver-industrys-first-45nm-single-chip-digital-tv-platform-3976/</guid>
		<description><![CDATA[EINDHOVEN, The Netherlands and HSINCHU, Taiwan, R.O.C. - 
- Accelerates TV set development; dramatically reduces cost of production

NXP Semiconductors and Taiwan Semiconductor Manufacturing Company, Ltd. (NYSE: TSM) (TWSE: 2330) today announced their cooperation to deliver the industry&#8217;s first single-chip 45nm global LCD TV platform, TV550. With NXP already delivering the engineering samples to its lead [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/nxp-and-tsmc-deliver-industrys-first-45nm-single-chip-digital-tv-platform-3976/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC Enhances 0.13-micron Family</title>
		<link>http://blog.taragana.com/pr/tsmc-enhances-013-micron-family-3626/</link>
		<comments>http://blog.taragana.com/pr/tsmc-enhances-013-micron-family-3626/#comments</comments>
		<pubDate>Mon, 29 Jun 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[New Products / Services]]></category>

		<category><![CDATA[Semiconductors]]></category>

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		<category><![CDATA[Hsinchu]]></category>

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		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-enhances-013-micron-family-3626/</guid>
		<description><![CDATA[HSINCHU, Taiwan, R.O.C. - 
- Area reduction and performance gain with slim platform for analog and power management system-on-chip applications

Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that it has released an enhanced version of its 0.13-micron process to benefit customers&#8217; cost and competition and to enable the integration of power management [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-enhances-013-micron-family-3626/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC Qualifies New 0.18-Micron Embedded Flash Family</title>
		<link>http://blog.taragana.com/pr/tsmc-qualifies-new-018-micron-embedded-flash-family-697/</link>
		<comments>http://blog.taragana.com/pr/tsmc-qualifies-new-018-micron-embedded-flash-family-697/#comments</comments>
		<pubDate>Tue, 31 Mar 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
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		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-qualifies-new-018-micron-embedded-flash-family-697/</guid>
		<description><![CDATA[HSIN-CHU, Taiwan, R.O.C. -  Ideal for power sensitive, automotive and analog applications
Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330; NYSE: TSM)
today announced that it has qualified its new 0.18-micron embedded flash
(embFlash) process technology family that targets a wide range of
applications. The new family includes a baseline 1.8 to 5 volt standard
process, an ultra-low leakage process, [...]]]></description>
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