<?xml version="1.0" encoding="UTF-8"?>
<rss version="2.0"
	xmlns:content="http://purl.org/rss/1.0/modules/content/"
	xmlns:wfw="http://wellformedweb.org/CommentAPI/"
	xmlns:dc="http://purl.org/dc/elements/1.1/"
	xmlns:atom="http://www.w3.org/2005/Atom"
	xmlns:sy="http://purl.org/rss/1.0/modules/syndication/"
	>

<channel>
	<title>PR Hub &#187; TSMC</title>
	<atom:link href="http://blog.taragana.com/pr/t/tsmc/feed/" rel="self" type="application/rss+xml" />
	<link>http://blog.taragana.com/pr</link>
	<description></description>
	<pubDate>Tue, 23 Feb 2010 08:06:57 +0000</pubDate>
	<generator>http://wordpress.org/?v=2.7.1</generator>
	<language>en</language>
	<sy:updatePeriod>hourly</sy:updatePeriod>
	<sy:updateFrequency>1</sy:updateFrequency>
			<item>
		<title>Dialog Semiconductor and TSMC Collaborate on Industry-Leading BCD Process for Power Management ICs</title>
		<link>http://blog.taragana.com/pr/dialog-semiconductor-and-tsmc-collaborate-on-industry-leading-bcd-process-for-power-management-ics-13608/</link>
		<comments>http://blog.taragana.com/pr/dialog-semiconductor-and-tsmc-collaborate-on-industry-leading-bcd-process-for-power-management-ics-13608/#comments</comments>
		<pubDate>Tue, 23 Feb 2010 05:00:00 +0000</pubDate>
		<dc:creator>Tsmc</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[Licensing / Marketing Agreements]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[February 23]]></category>

		<category><![CDATA[Germany]]></category>

		<category><![CDATA[Germany And Hsinchu]]></category>

		<category><![CDATA[Kirchheim/teck]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/dialog-semiconductor-and-tsmc-collaborate-on-industry-leading-bcd-process-for-power-management-ics-13608/</guid>
		<description><![CDATA[Dialog raises level of power management integration to address needs of future portable devices such as smartphones, ebooks, netbooks

KIRCHHEIM/TECK, Germany and HSINCHU, Taiwan, R.O.C., February 23, 2010  - Dialog Semiconductor plc (FWB: DLG), a leading provider of highly
integrated innovative power management semiconductor solutions, today
announced that the company is working closely with foundry partner Taiwan
Semiconductor [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/dialog-semiconductor-and-tsmc-collaborate-on-industry-leading-bcd-process-for-power-management-ics-13608/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC to Take Delivery of an ASML EUV Lithography System for Research and Development on Future Technology Generations</title>
		<link>http://blog.taragana.com/pr/tsmc-to-take-delivery-of-an-asml-euv-lithography-system-for-research-and-development-on-future-technology-generations-13526/</link>
		<comments>http://blog.taragana.com/pr/tsmc-to-take-delivery-of-an-asml-euv-lithography-system-for-research-and-development-on-future-technology-generations-13526/#comments</comments>
		<pubDate>Sun, 21 Feb 2010 05:00:00 +0000</pubDate>
		<dc:creator>Tsmc</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[Nanotechnology]]></category>

		<category><![CDATA[New Products / Services]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[February 22]]></category>

		<category><![CDATA[Netherlands and hsinchu]]></category>

		<category><![CDATA[Netherlands Antil]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<category><![CDATA[Veldhoven]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-to-take-delivery-of-an-asml-euv-lithography-system-for-research-and-development-on-future-technology-generations-13526/</guid>
		<description><![CDATA[Agreement underscores TSMC&apos;s continuing investment in the European semiconductor community

VELDHOVEN, Netherlands and HSINCHU, Taiwan, R.O.C., February 22, 2010  - ASML Holding NV (ASML) today announced that Taiwan Semiconductor
Manufacturing Company (TWSE: 2330, NYSE: TSM) will take delivery of a
TWINSCAN NXE:3100 extreme ultra-violet (EUV) lithography system. This tool
represents one of six NXE:3100 EUV systems for ASML&#39;s [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-to-take-delivery-of-an-asml-euv-lithography-system-for-research-and-development-on-future-technology-generations-13526/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC Helps LSI Reduce Leakage 25 Percent on Next Generation Product</title>
		<link>http://blog.taragana.com/pr/tsmc-helps-lsi-reduce-leakage-25-percent-on-next-generation-product-11241/</link>
		<comments>http://blog.taragana.com/pr/tsmc-helps-lsi-reduce-leakage-25-percent-on-next-generation-product-11241/#comments</comments>
		<pubDate>Wed, 06 Jan 2010 05:00:00 +0000</pubDate>
		<dc:creator>Tsmc</dc:creator>
		
		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-helps-lsi-reduce-leakage-25-percent-on-next-generation-product-11241/</guid>
		<description><![CDATA[PowerTrim gate length biasing optimizes power with no area or performance compromise

HSINCHU, Taiwan, January 6  - Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) (TWSE: 2330,
NYSE: TSM) today announced that LSI Corporation achieved over 25% overall
leakage reduction in a next generation product by implementing TSMC&#39;s
PowerTrim power optimization technology on the company&#39;s 65nm low power (LP)
process.
  [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-helps-lsi-reduce-leakage-25-percent-on-next-generation-product-11241/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC Announces Process Technologies for Integrated LED Drivers</title>
		<link>http://blog.taragana.com/pr/tsmc-announces-process-technologies-for-integrated-led-drivers-10661/</link>
		<comments>http://blog.taragana.com/pr/tsmc-announces-process-technologies-for-integrated-led-drivers-10661/#comments</comments>
		<pubDate>Tue, 15 Dec 2009 05:00:00 +0000</pubDate>
		<dc:creator>Tsmc</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[New Products / Services]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-announces-process-technologies-for-integrated-led-drivers-10661/</guid>
		<description><![CDATA[Integration Features Lowers Overall Systems Component Counts
HSINCHU, Taiwan, R.O.C., December 15  - Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM)
today unveiled modular BCD (Bipolar, CMOS DMOS) process technologies
targeting high voltage integrated LED driver devices.

    The new BCD technologies feature a voltage spectrum running from 12 to 60
volts to support multiple [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-announces-process-technologies-for-integrated-led-drivers-10661/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC Launches Automotive Process Qualification Specification and Service Package in China Market</title>
		<link>http://blog.taragana.com/pr/tsmc-launches-automotive-process-qualification-specification-and-service-package-in-china-market-9622/</link>
		<comments>http://blog.taragana.com/pr/tsmc-launches-automotive-process-qualification-specification-and-service-package-in-china-market-9622/#comments</comments>
		<pubDate>Fri, 27 Nov 2009 05:00:00 +0000</pubDate>
		<dc:creator>Tsmc</dc:creator>
		
		<category><![CDATA[Asian Related]]></category>

		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[Multicultural]]></category>

		<category><![CDATA[New Products / Services]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-launches-automotive-process-qualification-specification-and-service-package-in-china-market-9622/</guid>
		<description><![CDATA[TSMC Commits to China Automotive Excellence by Meeting AEC Guidelines
HSINCHU, Taiwan, November 27  - Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM)
today announced that it plans to launch the automotive industry&#39;s first
process qualification specification and service package for automotive-grade
semiconductor manufacturing at the China IC Design Conference being held in
Xiamen on December 2.

  [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-launches-automotive-process-qualification-specification-and-service-package-in-china-market-9622/feed/</wfw:commentRss>
		</item>
		<item>
		<title>Additional Detail Regarding TSMC Expects Next Year to be a Record Year</title>
		<link>http://blog.taragana.com/pr/additional-detail-regarding-tsmc-expects-next-year-to-be-a-record-year-8285/</link>
		<comments>http://blog.taragana.com/pr/additional-detail-regarding-tsmc-expects-next-year-to-be-a-record-year-8285/#comments</comments>
		<pubDate>Fri, 30 Oct 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[Earnings Projections / Forecasts]]></category>

		<category><![CDATA[Investors]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/additional-detail-regarding-tsmc-expects-next-year-to-be-a-record-year-8285/</guid>
		<description><![CDATA[HSINCHU, Taiwan, R.O.C. - 
At TSMC&#8217;s third quarter investors&#8217; conference on October 29, TSMC Chairman Dr. Morris Chang commented that &#8220;For TSMC, we expect next year to be a record year.&#8221; TSMC Spokesperson and Chief Financial Officer Ms. Lora Ho provides additional detail regarding this statement.

&#8220;Setting a record year in 2010 is TSMC&#8217;s internal target [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/additional-detail-regarding-tsmc-expects-next-year-to-be-a-record-year-8285/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC Adds High-K Metal Gate Low Power Process to 28nm Road Map</title>
		<link>http://blog.taragana.com/pr/tsmc-adds-high-k-metal-gate-low-power-process-to-28nm-road-map-5090/</link>
		<comments>http://blog.taragana.com/pr/tsmc-adds-high-k-metal-gate-low-power-process-to-28nm-road-map-5090/#comments</comments>
		<pubDate>Mon, 24 Aug 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[New Products / Services]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-adds-high-k-metal-gate-low-power-process-to-28nm-road-map-5090/</guid>
		<description><![CDATA[HSINCHU, Taiwan, R.O.C. - 
- Risk production expected in Q3 2010
Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that it is adding a low power process to its 28nm high-k metal gate (HKMG) road map. The new process is expected to enter risk production in the third quarter of 2010.

TSMC&#8217;s 28nm development [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-adds-high-k-metal-gate-low-power-process-to-28nm-road-map-5090/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC Achieves 28nm SRAM Yield Breakthrough</title>
		<link>http://blog.taragana.com/pr/tsmc-achieves-28nm-sram-yield-breakthrough-5093/</link>
		<comments>http://blog.taragana.com/pr/tsmc-achieves-28nm-sram-yield-breakthrough-5093/#comments</comments>
		<pubDate>Mon, 24 Aug 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-achieves-28nm-sram-yield-breakthrough-5093/</guid>
		<description><![CDATA[HSINCHU, Taiwan, R.O.C. - 
- Key process development achievement demonstrates gate-last approach manufacturing benefits

Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) has become the first foundry not only to achieve 28nm functional 64Mb SRAM yield, but also to achieve it across all three 28nm nodes.
&#8220;Achieving 64Mb SRAM yield across all three 28nm process nodes [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-achieves-28nm-sram-yield-breakthrough-5093/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC Extends Design Methodology Leadership to 28nm With Reference Flow 10.0</title>
		<link>http://blog.taragana.com/pr/tsmc-extends-design-methodology-leadership-to-28nm-with-reference-flow-100-4318/</link>
		<comments>http://blog.taragana.com/pr/tsmc-extends-design-methodology-leadership-to-28nm-with-reference-flow-100-4318/#comments</comments>
		<pubDate>Wed, 22 Jul 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[New Products / Services]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-extends-design-methodology-leadership-to-28nm-with-reference-flow-100-4318/</guid>
		<description><![CDATA[HSINCHU, Taiwan - 
- Introduces SiP design solutions for the first time and continues to drive differentiated features in power, performance and DFM

Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE:2330, NYSE: TSM) today unveiled Reference Flow 10.0, the latest version of its industry-leading design methodology to lower design obstacles, improve design margins, and increase yields. Reference Flow [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-extends-design-methodology-leadership-to-28nm-with-reference-flow-100-4318/feed/</wfw:commentRss>
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		<item>
		<title>TSMC Launches Unified Physical Verification Format for Advanced Process Technologies</title>
		<link>http://blog.taragana.com/pr/tsmc-launches-unified-physical-verification-format-for-advanced-process-technologies-4273/</link>
		<comments>http://blog.taragana.com/pr/tsmc-launches-unified-physical-verification-format-for-advanced-process-technologies-4273/#comments</comments>
		<pubDate>Tue, 21 Jul 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[New Products / Services]]></category>

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		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-launches-unified-physical-verification-format-for-advanced-process-technologies-4273/</guid>
		<description><![CDATA[HSINCHU, Taiwan, R.O.C. - 
- New iDRC and iLVS Data Formats Ensure Data Accuracy and Enable Extensive EDA Support of Physical Verification Related Applications in TSMC 40nm Process

Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today unveiled interoperable design rule check (iDRC) and layout-versus-schematic (iLVS), two unified electronic design automation (EDA) data formats, for [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-launches-unified-physical-verification-format-for-advanced-process-technologies-4273/feed/</wfw:commentRss>
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		<item>
		<title>TSMC Launches First Advanced Technology Interoperable Process Design Kit</title>
		<link>http://blog.taragana.com/pr/tsmc-launches-first-advanced-technology-interoperable-process-design-kit-4275/</link>
		<comments>http://blog.taragana.com/pr/tsmc-launches-first-advanced-technology-interoperable-process-design-kit-4275/#comments</comments>
		<pubDate>Tue, 21 Jul 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[New Products / Services]]></category>

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		<category><![CDATA[Technology]]></category>

		<category><![CDATA[China]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

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		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-launches-first-advanced-technology-interoperable-process-design-kit-4275/</guid>
		<description><![CDATA[HSINCHU, Taiwan, R.O.C. - 
- Industry-Wide Collaborative Development Effort Delivers First Unified iPDK for 65nm Process

Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced the release of the semiconductor industry&#8217;s first interoperable process design kit (iPDK) for advanced technology. The kit is fully validated on TSMC&#8217;s 65 nanometer (nm) process and represents the [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-launches-first-advanced-technology-interoperable-process-design-kit-4275/feed/</wfw:commentRss>
		</item>
		<item>
		<title>NetLogic Microsystems and TSMC Collaborate on Industry-Leading 40nm Technology for Next-Generation Knowledge-based Processors and 10/40/100 Gigabit Physical Layer Solutions</title>
		<link>http://blog.taragana.com/pr/netlogic-microsystems-and-tsmc-collaborate-on-industry-leading-40nm-technology-for-next-generation-knowledge-based-processors-and-1040100-gigabit-physical-layer-solutions-4145/</link>
		<comments>http://blog.taragana.com/pr/netlogic-microsystems-and-tsmc-collaborate-on-industry-leading-40nm-technology-for-next-generation-knowledge-based-processors-and-1040100-gigabit-physical-layer-solutions-4145/#comments</comments>
		<pubDate>Wed, 15 Jul 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Business]]></category>

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		<category><![CDATA[california]]></category>

		<category><![CDATA[Californiahsinchu]]></category>

		<category><![CDATA[Mountain view]]></category>

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		<guid isPermaLink="false">http://blog.taragana.com/pr/netlogic-microsystems-and-tsmc-collaborate-on-industry-leading-40nm-technology-for-next-generation-knowledge-based-processors-and-1040100-gigabit-physical-layer-solutions-4145/</guid>
		<description><![CDATA[MOUNTAIN VIEW, California and HSINCHU, Taiwan, R.O.C. - 
- NetLogic Microsystems Successfully Migrates Multiple Product Lines to TSMC&#8217;s Advanced 40nm Technology Node to offer customers significantly higher performance, lower power consumption and advanced features that enable next-generation networking, communications, data center, security and storage applications

NetLogic Microsystems, Inc. [Nasdaq: NETL], a leader in the design and [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/netlogic-microsystems-and-tsmc-collaborate-on-industry-leading-40nm-technology-for-next-generation-knowledge-based-processors-and-1040100-gigabit-physical-layer-solutions-4145/feed/</wfw:commentRss>
		</item>
		<item>
		<title>NXP and TSMC Deliver Industry&#8217;s First 45nm Single-Chip Digital TV Platform</title>
		<link>http://blog.taragana.com/pr/nxp-and-tsmc-deliver-industrys-first-45nm-single-chip-digital-tv-platform-3976/</link>
		<comments>http://blog.taragana.com/pr/nxp-and-tsmc-deliver-industrys-first-45nm-single-chip-digital-tv-platform-3976/#comments</comments>
		<pubDate>Thu, 09 Jul 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
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		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Eindhoven]]></category>

		<category><![CDATA[Netherlands]]></category>

		<category><![CDATA[Netherlands and hsinchu]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/nxp-and-tsmc-deliver-industrys-first-45nm-single-chip-digital-tv-platform-3976/</guid>
		<description><![CDATA[EINDHOVEN, The Netherlands and HSINCHU, Taiwan, R.O.C. - 
- Accelerates TV set development; dramatically reduces cost of production

NXP Semiconductors and Taiwan Semiconductor Manufacturing Company, Ltd. (NYSE: TSM) (TWSE: 2330) today announced their cooperation to deliver the industry&#8217;s first single-chip 45nm global LCD TV platform, TV550. With NXP already delivering the engineering samples to its lead [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/nxp-and-tsmc-deliver-industrys-first-45nm-single-chip-digital-tv-platform-3976/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC Unveils First Commercial 65-Nanometer Multi-Time Programmable Non-Volatile Memory Technology</title>
		<link>http://blog.taragana.com/pr/tsmc-unveils-first-commercial-65-nanometer-multi-time-programmable-non-volatile-memory-technology-3768/</link>
		<comments>http://blog.taragana.com/pr/tsmc-unveils-first-commercial-65-nanometer-multi-time-programmable-non-volatile-memory-technology-3768/#comments</comments>
		<pubDate>Thu, 02 Jul 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[New Products / Services]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-unveils-first-commercial-65-nanometer-multi-time-programmable-non-volatile-memory-technology-3768/</guid>
		<description><![CDATA[HSINCHU, Taiwan - 
- Provides greater design flexibility and higher performance
Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced the foundry segment&#8217;s first functional 65-nanometer (nm) multi-time programmable (MTP) non-volatile memory (NVM) process technology. The technology incorporates process-qualified MTP IP blocks jointly developed with Virage Logic. The new technology is the first 2.5 [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-unveils-first-commercial-65-nanometer-multi-time-programmable-non-volatile-memory-technology-3768/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC Enhances 0.13-micron Family</title>
		<link>http://blog.taragana.com/pr/tsmc-enhances-013-micron-family-3626/</link>
		<comments>http://blog.taragana.com/pr/tsmc-enhances-013-micron-family-3626/#comments</comments>
		<pubDate>Mon, 29 Jun 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[New Products / Services]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[R.o.c.]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-enhances-013-micron-family-3626/</guid>
		<description><![CDATA[HSINCHU, Taiwan, R.O.C. - 
- Area reduction and performance gain with slim platform for analog and power management system-on-chip applications

Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that it has released an enhanced version of its 0.13-micron process to benefit customers&#8217; cost and competition and to enable the integration of power management [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-enhances-013-micron-family-3626/feed/</wfw:commentRss>
		</item>
		<item>
		<title>Fujitsu Microelectronics and TSMC to Collaborate on Leading-edge Process Technology</title>
		<link>http://blog.taragana.com/pr/fujitsu-microelectronics-and-tsmc-to-collaborate-on-leading-edge-process-technology-1699/</link>
		<comments>http://blog.taragana.com/pr/fujitsu-microelectronics-and-tsmc-to-collaborate-on-leading-edge-process-technology-1699/#comments</comments>
		<pubDate>Thu, 30 Apr 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Asian Related]]></category>

		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[Licensing / Marketing Agreements]]></category>

		<category><![CDATA[Multicultural]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Japan]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[Tokyohsin-chu]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/fujitsu-microelectronics-and-tsmc-to-collaborate-on-leading-edge-process-technology-1699/</guid>
		<description><![CDATA[TOKYO and HSIN-CHU, Taiwan - Fujitsu Microelectronics Limited and Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that they will collaborate on leading-edge process technology production for the manufacturing of Fujitsu Microelectronics&#8217; products. Under an agreement between the companies, Fujitsu Microelectronics will expand its 40-nanometer generation logic IC business with production at [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/fujitsu-microelectronics-and-tsmc-to-collaborate-on-leading-edge-process-technology-1699/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC Launches Integrated Sign-Off Flow to Shorten Design Cycle, Enhance Tape-Out Quality</title>
		<link>http://blog.taragana.com/pr/tsmc-launches-integrated-sign-off-flow-to-shorten-design-cycle-enhance-tape-out-quality-1340/</link>
		<comments>http://blog.taragana.com/pr/tsmc-launches-integrated-sign-off-flow-to-shorten-design-cycle-enhance-tape-out-quality-1340/#comments</comments>
		<pubDate>Tue, 21 Apr 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[New Products / Services]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-launches-integrated-sign-off-flow-to-shorten-design-cycle-enhance-tape-out-quality-1340/</guid>
		<description><![CDATA[HSINCHU, Taiwan -  Open Innovation Platform Drives First Comprehensive and Executable RTL To GDSII Design Flow

Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330, NYSE: TSM) today unveiled the first foundry-specific Integrated Sign-Off Flow at its North American Technology Symposium in San Jose, CA. The new flow is available now for 65nm designs.
Integrated Sign-Off Flow is [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-launches-integrated-sign-off-flow-to-shorten-design-cycle-enhance-tape-out-quality-1340/feed/</wfw:commentRss>
		</item>
		<item>
		<title>TSMC Announces Foundry&#8217;s First Mixed Signal/RF Reference Design Kit</title>
		<link>http://blog.taragana.com/pr/tsmc-announces-foundrys-first-mixed-signalrf-reference-design-kit-1341/</link>
		<comments>http://blog.taragana.com/pr/tsmc-announces-foundrys-first-mixed-signalrf-reference-design-kit-1341/#comments</comments>
		<pubDate>Tue, 21 Apr 2009 05:00:00 +0000</pubDate>
		<dc:creator>Prne</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Computer / Electronics]]></category>

		<category><![CDATA[New Products / Services]]></category>

		<category><![CDATA[Technology]]></category>

		<category><![CDATA[Hsinchu]]></category>

		<category><![CDATA[taiwan]]></category>

		<category><![CDATA[TSMC]]></category>

		<category><![CDATA[United Kingdom]]></category>

		<guid isPermaLink="false">http://blog.taragana.com/pr/tsmc-announces-foundrys-first-mixed-signalrf-reference-design-kit-1341/</guid>
		<description><![CDATA[HSINCHU, Taiwan -  Silicon-proven Reference Design Approach Accelerates RF Designs and Enables Systems-on-Chip Integration

Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330; NYSE: TSM) today unveiled the foundry industry&#8217;s first Mixed Signal/Radio Frequency Reference Design Kit (MS/RF RDK) at its North American Technology Symposium in San Jose. The RDK initially targets 65nm process technology and aims [...]]]></description>
		<wfw:commentRss>http://blog.taragana.com/pr/tsmc-announces-foundrys-first-mixed-signalrf-reference-design-kit-1341/feed/</wfw:commentRss>
		</item>
	</channel>
</rss>

