TSMC and MAPPER Reached Joint Development Milestone

By Tsmc Mapper, PRNE
Thursday, February 18, 2010

Global relationship underscores TSMC's participation in Euro tech development

HSINCHU, Taiwan and DELFT, Netherlands, February 19, 2010 - Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM) and
MAPPER Lithography today revealed that a pre-alpha MAPPER tool located on
TSMC's Fab 12 GigaFab(TM) is repeatedly printing features previously
unachievable using current immersion lithography technology.

Over the past several months TSMC has expanded its Maskless Lithography
team and has been working with MAPPER engineers at Fab 12 to integrate
electron beam direct write capabilities into manufacturing processes for
development of future technology nodes.

"TSMC is always searching for the most cost effective manufacturing
processes," says Dr. Shang-Yi Chiang, TSMC Senior Vice President of Research
& Development. "The results coming from our project with MAPPER have met
aggressive objectives and mark a significant achievement in our
Multiple-E-Beam Direct Write program that covers all viable Multiple-E-Beam
technologies. Based on these encouraging results, we are convinced that the
Multiple-E-Beam technology is one of the technologies to become the future
lithography standard."

Dr. Christopher Hegarty, MAPPER's CEO adds, "Having TSMC as our launch
customer is of great benefit to MAPPER. Now that we have an operational tool
at TSMC and we simultaneously intensify our efforts in bringing MAPPER's
technology to market, we are supremely confident that electron beam direct
write will be successfully introduced into high-volume manufacturing
processes."

TSMC and MAPPER will present their latest results at the SPIE Advanced
Lithography 2010 conference in San Jose, CA.

MAPPER's Technology

MAPPER develops lithography machines for the chip industry. These
machines utilize a new and innovative technology with which the chips of the
future can be made cost effectively. MAPPER's machine provides a highly
cost-effective way of making the next generation of chips because it
significantly reduces costs by eliminating the photomask while simultaneously
providing the ultimate in resolution and high productivity. MAPPER's
technology makes use of massively parallel electron beams, thereby providing
the very high resolution of electron beam at extremely high throughput.
Current lithography machines use photographic techniques to create minute
electrical circuits smaller than 1/100th of a human hair on a silicon wafer.
They use a mask that contains the blueprint of the chip and transfer this
pattern on to a photosensitive layer (comparable to a photograph being
exposed on film), however the photographic techniques used are very limited
in the resolution they can provide and are no longer adequate for future
generations of semiconductors.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry's largest portfolio
of process-proven libraries, IPs, design tools and reference flows. The
Company's managed capacity in 2009 totaled 9.96 million (8-inch equivalent)
wafers, including capacity from two advanced 12-inch GIGAFABs(TM), four
eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned
subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC
is the first foundry to provide 40nm production capabilities. Its corporate
headquarters are in Hsinchu, Taiwan. For more information about TSMC please
visit www.tsmc.com.

About MAPPER Lithography

MAPPER's offices are located in Delft, The Netherlands, near Delft
University of Technology, one of the shareholders. MAPPER has a headcount of
170 people. Shareholders of MAPPER are, besides Delft University of
Technology, professional investors - Capital-C Ventures, KT Venture Group,
Quest for Growth and KBC Private Equity - and private investors.

Bert Jan Kampherbeek, Vice President Market Development of MAPPER Lithography, +31-15-888-0250; or TSMC Acting Spokesman, J.H. Tzeng, Deputy Director, Public Relations, +886-3-505-5028, or Michael Kramer, Senior Administrator, Public Relations, +886-3-505-6216, both of TSMC

YOUR VIEW POINT
NAME : (REQUIRED)
MAIL : (REQUIRED)
will not be displayed
WEBSITE : (OPTIONAL)
YOUR
COMMENT :