Fries Research & Technology GmbH

Semicon Europa: FRT Introduces Ultra High Aspect-Ratio Measurements for Through-Silicon Vias (TSV) in 3D Wafer Packaging

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BERGISCH GLADBACH, Germany - At this year's Semicon Europa 2009, FRT again presents innovative wafer metrology solutions for R&D and process control tasks in MEMS, semiconductor, and photovoltaic production.

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