Helic EDA Solutions in TSMC RF Reference Design Kit 3.0

By Helic, PRNE
Tuesday, May 31, 2011

SAN FRANCISCO, June 1, 2011 -

Helic Inc., the technology leader in synthesis and verification solutions
for RF and high-speed IC design, today announced the TSMC RF Reference Design
Kit 3.0 (RF RDK) incorporates its EDA products for EM modeling and RF
substrate noise coupling analysis.

Helic has contributed to the development of a comprehensive RF RDK 3.0
design flow which now supports electromagnetics (EM) modeling which is
compliant with TSMC's dummy fill insertion methodology, leveraging
capabilities of Helic's VeloceRF(TM) toolset. This allows designers of RF and
high-speed custom ICs in TSMC's nanoscale processes to predictably design
spiral inductors with improved yield and reduced manufacturing risks.
Additionally, Helic's recently introduced substrate modeling product, which
ships as part of its VeloceRaptor/X(TM) toolset, provides capabilities for
the prediction of RF noise propagation through silicon substrate, thus
helping resolve one of the major problems plaguing nanoscale SoC designs.

"Helic is an important vendor in the TSMC ecosystem, bringing unique
technology to our analog and mixed-signal design infrastructure, said Suk
, director of Design Infrastructure Marketing at TSMC. "Their advanced
inductor synthesis and EM modeling solutions ideally complement the TSMC
design methodology for high-performance RF design.

"It gives us great pleasure to be a key contributor in the TSMC RF RDK
3.0," said Sotiris Bantas, Helic Vice President of Technology. "Customers who
use the RF RDK 3.0 will have access to a cutting-edge methodology for
high-frequency and high-speed nanoscale silicon design. TSMC has qualified
our latest solutions for metal-fill-aware EM modeling and substrate noise
analysis, using a real silicon vehicle. This brings tremendous value to our
mutual customers designing high-performance solutions for wireless and
high-speed connectivity markets.

About Helic

Helic, Inc. develops disruptive EDA technology for RFIC and
System-in-Package design. Helic provide to customers value with a business
model combining EDA tools, IP and services, enabling first-pass silicon while
greatly reducing the development cycles of integrated wireless transceiver
products. VeloceRF(TM) is Helic's leading EDA tool for integrated inductor
synthesis, modeling, and verification. Helic's products have been adopted by
many renowned semiconductor companies worldwide, with over 500 designers as

Helic is headquartered at 101 Montgomery Street, suite 2650, San
Francisco, CA
94104. For additional information please visit Helic at

Press Contact: Sotiris Bantas, Ph.D. T: +1-866-994-3542

will not be displayed