Metamaterial Pioneer Rayspan to Present IEEE Distinguished Lecture and Exhibit Its WLAN and WWAN Applications at the Third European Conference on Antennas and Propagation (EuCAP 2009)

By Prne, Gaea News Network
Sunday, March 15, 2009

SAN DIEGO - Rayspan Corporation, the world’s leading innovator of Metamaterial air
interface solutions, is proud to announce that its Chief Technology Officer
Dr. Maha Achour will give the IEEE Distinguished Lecture entitled “The Road
to 4G through Metamaterial Air Interface Technology: Long Term Evolution
(LTE) and Beyond” at the third European Conference on Antennas and
Propagation (EuCAP 2009). The company will also exhibit its latest WLAN and
WWAN Metamaterial handset solutions.

Dr. Achour has stated that “Emerging 4G wireless broadband access
standards will require support of data rates not previously achievable in
compact mobile devices. More specifically, 3GPP Long Term Evolution - LTE -
must enable 100 Mb/sec downlink and 50 Mb/sec uplink peak speeds. This is
accomplished through use of wideband channels at frequencies as low as 700
MHz, advanced modulation techniques, and above all
Multiple-Input-Multiple-Output (MIMO) antenna technology. But until now,
implementing MIMO solutions in the small area and volume available in a
compact mobile device resulted in serious reductions in system throughput and
range.

Only Rayspan’s breakthrough Metamaterial MIMO solutions can achieve full
MIMO performance within the ultra-compact antenna size and close antenna
proximity required for implementation in small mobile wireless devices.
Metamaterial MIMO permits antenna size and antenna spacing to be less than
one fifteenth of a wavelength, and because these antennas are printed
directly on a mobile device PCB they occupy nearly zero volume. Moreover,
they are easily fabricated at extremely low cost, enabling rapid commercially
successful deployment.”

Rayspan’s Metamaterial antenna structures have a unique capability to
concentrate electromagnetic fields and currents very closely to antenna
structures rather than spreading them along antenna grounds, greatly reducing
coupling among antennas. Eliminating coupling among antennas in a MIMO array
achieves full de-correlation of multipath channels and achieves full MIMO
throughput and range.

Since its founding in April 2006, Rayspan has focused on innovating and
implementing Metamaterials technology to solve the fundamental challenges of
the wireless communications air interface - an essential part of every radio
that includes the antenna and all associated RF front-end components. As
standards have proliferated to include 3/4G cellular, WiFi MIMO, GPS,
Bluetooth, WiMax and UWB, the air interface now presents some of the most
difficult system integration problems facing the wireless industry.

Metamaterial solutions available from Rayspan today include a broad line
of single and multi-band antennas and arrays together with complementary
directional couplers, power combiners and power splitters. These solutions
address virtually all segments of the billion unit wireless local- and
wide-area network equipment markets, and they can be implemented quickly and
inexpensively by Rayspan’s licensees.

Source: Rayspan Corporation

Franz Birkner, President & CEO of Rayspan Corporation, +1-858-259-9596, ext. 222, franz at rayspan.com

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