TSMC Announces Process Technologies for Integrated LED Drivers

Integration Features Lowers Overall Systems Component Counts

HSINCHU, Taiwan, R.O.C., December 15 - Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM)
today unveiled modular BCD (Bipolar, CMOS DMOS) process technologies
targeting high voltage integrated LED driver devices.

The new BCD technologies feature a voltage spectrum running from 12 to 60
volts to support multiple LED applications including LCD flat panel display
backlighting, LED displays, general lighting and automotive lighting. The
technology portfolio spans process nodes from 0.6-micron to 0.18-micron with
a number of digital core modular options for varying digital control circuit
gate densities. The CyberShuttle(TM) prototyping service supports the
0.25-micron and 0.18-micron processes for preliminary function verification.

The new processes provide a number of integration features that reduce a
system's component counts. The robust high voltage DMOS capability provides
MOSFET switch integration to reduce the bill of materials (BOM). The
integrated component options include high voltage bipolar transistors, high
voltage, high precision capacitors, high resistance poly and Zener diodes to
reduce external passive component count and significantly reduce circuit
board area.

The DMOS process supports foundry's leading Rdson performance (i.e.; 72
mohm per mm2 at BV>80 volts for a specific 60V NLDMOS) and its high current
driving capability optimizes device sizes that enhance power efficiency. A
robust safe operating area (SOA) makes it ideal for both power switch and
driver design. Fine detailed characterization also provides a useful
reference to optimize the design budget for optimum chip size.

On the CMOS side, a 5-volt capability supports analog Pulse Width
Modulation (PWM) controller design elements and the 2.5-volt and 1.8-volt
logic cores are optional modules for higher-level digital integration. In
addition, logic compatible one-time programmable (OTP) and multi-time
programmable (MTP) memory options are available for enhanced digital
programming design.

"The new BCD technologies for LED drivers are very leading edge in
driving device integration. The associated PDKs feature highly accurate SPICE
models that really enhance the potential for easy single chip design," points
out George Liu, Director, Industrial Business Development. "In addition,
mismatching models help optimize current mismatching performance in
multi-channel LED driver designs."

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry's largest portfolio
of process-proven libraries, IP, design tools and reference flows. The
Company's total managed capacity in 2008 exceeded 9 million 8-inch equivalent
wafers, including capacity from two advanced 12-inch -GigaFabs(TM), four
eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned
subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC.
TSMC is the first foundry to provide 40nm production capabilities. Its
corporate headquarters are in Hsinchu, Taiwan. For more information about
TSMC please visit www.tsmc.com.

Ferda Mehmet, A&R Edelman, +1-650-762-2946, mobile, +1-415-308-7877; Michael Kramer, Corporate Public Relations, TSMC, 886-3-5636688 ext: 7126216