Revolutionary Heat Transfer Material to be Launched at electronica 2010By Elektron Ventures, PRNE
Monday, November 8, 2010
Interviews available at Hall A2, Stand 156 at electronica 2010
MUNICH, November 9, 2010 - Elektron Ventures (www.elektronplc.com/about_us/) is today
unveiling a brand new porous copper material that will transform cooling
systems and enable faster processing clock speeds.
AdvarienCu (220.127.116.11/) - a pioneering copper foam created
using a patented process - is materials efficient, non toxic and highly cost
effective, and is being launched at international trade show electronica 2010
in Munich (9-12 November).
Tests by a leading academic research group found AdvarienCu
(18.104.22.168/)-based liquid cooling devices to be three to ten times
more effective at transferring heat into a passing coolant than a
microchannel water block of similar size.
The innovative open cell copper foam allows significant controllable
porosity from 50 - 85%, resulting in a vast specific surface area, making
AdvarienCu (22.214.171.124/) an extremely effective material for
exchanging heat into a passing cooling fluid. The benefits of copper for
thermal management are well recognised, however AdvarienCu's open cell porous
structure allows coolant fluid to carry heat away to a radiator more
effectively than expensive micro-machined structures and removes the need to
install a bulky fan.
Neill Ricketts, managing director of Elektron Ventures (
www.elektronplc.com/about_us/) said: "AdvarienCu (126.96.36.199/
) is a new and exciting material for the liquid cooling of semiconductor
devices which offers users dramatic technical and commercial benefits. It is
a simple, cost-effective manufacturing process and we offer a superior lead
time together with a dedicated technical support team. It is ideal for use in
PCs, servers, supercomputers, games consoles and industrial power
AdvarienCu (188.8.131.52/) can be fused at an atomic level to a
base plate, which coupled with its unprecedented surface area, ensures
ground-breaking levels of heat transfer between device and cooling fluid. The
process, known as Lost Carbonate Sintering (LCS) was developed by the
University of Liverpool and has a world-wide patent in place.
AdvarienCu (184.108.40.206/) is a branded technology of Elektron
Ventures (www.elektronplc.com/about_us/), a division of Elektron plc.
The company plans to develop further innovative Advarien advanced materials
products using the pioneering LCS process.
Neill Ricketts added: "As the world's leading electronics trade fair,
electronic 2010 is the ideal platform to launch AdvarienCu (
220.127.116.11/). We will be using the event to demonstrate the benefits
of the product to thermal management decision makers and end user design
teams from around the world."
Note to editors
Elektron Ventures is a division of Elektron plc (EKT:AIM)
The Lost Carbonate Sintering process (LCS) originated at the University
of Liverpool and developed as a TSB-funded project involving several
consortia partners - University of Liverpool, Total Carbide (an Elektron
Ventures company), C-Tech Innovation, Thermacore Europe, Vacua-Therm Sales
and Ecka Granules Metal Powders. The project 'Micro-Porous Metals for Thermal
Management' has been short-listed in the Manufacturing and Process Innovation
category of The Engineer Technology and Innovation Awards 2010 being
announced at The Royal Society, London on 3 December 2010.
To arrange an interview at electronica or for further information contact
Gayle Nicol, the BIG Partnership tel +44(0)1224-615019 or Jackie Robinson on
Tags: Elektron Ventures, Germany, Munich, November 9