ChipSiP Unveils Cutting-edge SiP Solutions to Experience an Unlimited Sharing Life

By Chipsip Technology Co Ltd., PRNE
Wednesday, October 5, 2011

TAIPEI, Taiwan, October 6, 2011 -

ChipSiP Technology Co, Ltd. (Taiwan: 3637), a leading company in turnkey SiP solutions, launched three new products featuring optimum slimness, portability and connectivity for a connected life of cloud computing through the integrated design of Logic, RF and Turnkey solutions. SiP is bringing a smart, connected life to consumers who will be able to share special moments of their lives with ease through various connected devices such as smartphones, digital cameras, camcorders, tablet PCs and TVs.

ChipSiP Chairperson Feng Lai said: “With mounting anticipation for multimedia devices such as tablet PCs and smartphones, we are launching the most high-density 7-in-1 SiP, a slimmest tablet PC with 9.85mm and the most light-weighted WiDi in the world weighing only 90 grams. In addition to the breakthrough in multi-chip design technology and device dimension, we have proven yet again that SiP technology embedded in daily life can be fun, easy and exciting, and the use of these multimedia applications will enable consumers to embrace a new lifestyle, thanks to those simple-to-use smart devices.”

Advanced SiP technology shrinks PCB size by a whopping 80% from mainstream tablet PCs

ChipSiP leverages its core value of system integration and miniaturization design to successfully combine application processor, 2 units of DDR3, 2 units of NAND, WiFi, Bluetooth in a 7-in-1 SiP that is only 18 x 18mm in size. This design will usher in a brand-new chapter for lighter and slimmer tablet PCs and smartphone.

ChipSiP also announced its enhanced WiDi design, a WiDi dongle that weighs only 90 grams and features the WiFi MIMO technology to allow multimedia contents such as video, photos and web pages to be transmitted wirelessly from PCs, tablet PCs, and smartphones to television.

ChipSiP develops a new tablet PC turnkey solution featuring a thickness as thin as 9.85mm and only 47mm2 in dimension to enable a lighter weight, better performance and better power-efficiency. With miniaturized memory SiP and RF SiP in combination with Android, consumers will enjoy more fun and convenience as a result of real-time sharing anytime, anywhere. In addition, ChipSiP will release a high-end tablet PC solution with CPU clock speed of 1GHz as well as the world’s thinnest design at 8.6mm in Q4.

Media Contact:

Fenny Chen
Phone: +886-2-8227-1799 ext. 2101


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