SOITEC Group Announces New Partnership With Distributor in China, Strengthening Far East Presence

SHANGHAI - The Soitec Group (Euronext Paris), the world’s leading supplier of
silicon-on-insulator (SOI) wafers and other engineered substrates for the
microelectronics industry, announced today a new partnership with a
distributor in China to strengthen its Far East presence. A member of the
Shanghai Semiconductor Association, Cantang Electronics Technology Inc. is a
professional service provider specialized in semiconductors, with staff and
engineers that understand SOI technology and its markets. Under the new
partnership agreement, Cantang Electronics will distribute, market and
support Soitec’s products and services throughout China.

“We look forward to a long and successful business relationship with this
well-established, reputable company, and are proud to have Cantang promoting
and distributing Soitec’s products and services. Cantang has a broad base of
contacts and customers across China that can benefit from our technology,”
says Paul Boudre, COO of the Soitec Group. “We already see opportunities in
both RF and power management applications in China for our 200mm SOI
products, with high market-growth potential.”

SOI is used today in a growing number of advanced electronic devices for
a wide variety of applications, ranging from automobiles to portable consumer
products. SOI-based chips are cost-efficient to manufacture, and designed to
be power-efficient and performance-enhancing. The timely convergence of
China’s technological readiness and increased industry-wide support for SOI
design and manufacturing can facilitate the move to SOI by China’s foundries
and fabless companies.

About the Soitec Group:

The Soitec Group is the world’s leading innovator and provider of the
engineered substrate solutions that serve as the foundation for today’s most
advanced microelectronic products. The group leverages its proprietary Smart
Cut(TM) technology to engineer new substrate solutions, such as
silicon-on-insulator (SOI) wafers, which became the first high-volume
application for this proprietary technology. Since then, SOI has emerged as
the material platform of the future, enabling the production of higher
performing, faster chips that consume less power.

Today, Soitec produces more than 80 percent of the world’s SOI wafers.
Headquartered in Bernin, France, with two high-volume fabs on-site, Soitec
has offices throughout the United States, Japan and Taiwan, and a new
production site in the process of customers’ qualification in Singapore.

Two other divisions, Picogiga International (Les Ulis) and Tracit
Technologies (Bernin), complete the Soitec Group. Picogiga delivers advanced
substrates solutions, including III-V epiwafers and gallium nitride
(GaN)-based wafers, to the compound material world for the manufacture of
high-frequency electronics and other optoelectronic devices. Tracit, on the
other hand, provides thin-film layer transfer technologies used to
manufacture advanced substrates for power ICs and microsystems, as well as
generic circuit transfer technology for applications such as image sensors
and 3D-integration. Shares of the Soitec Group are listed on Euronext Paris.
For more information, visit www.soitec.com.

Soitec, Smart Cut and UNIBOND are trademarks of S.O.I.TEC Silicon On
Insulator Technologies.

To contact Cantang Electronics in China:
Derek Wu, Cantang Electronics Technology Inc.
Unit 11, 76 Qiqihaer Rd., Shanghai, China
sales@cantang.com.cn / tel: +86-21-6589-3496

Press Contact: Camille Darnaud-Dufour
Tel (France): +33(0)6-79-49-51-43
E-mail: camille.darnaud-dufour@soitec.com

Source: Soitec Silicon