TSMC Launches Automotive Process Qualification Specification and Service Package in China Market

TSMC Commits to China Automotive Excellence by Meeting AEC Guidelines

HSINCHU, Taiwan, November 27 - Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM)
today announced that it plans to launch the automotive industry's first
process qualification specification and service package for automotive-grade
semiconductor manufacturing at the China IC Design Conference being held in
Xiamen on December 2.

The company also announced that its Fab 10, located in Shanghai, is
prepared to manufacture automotive grade ICs.

The automotive process qualification specification, made broadly public
today, was first proposed at the Automotive Electronic Council's (AEC) annual
Reliability Workshop in June 2008. Semiconductor devices in automobiles wear
out quickly due to the stringent operating environment, and it is critical
that the inherent manufacturing process can support semiconductor devices
that will last far beyond the vehicle's lifetime.

TSMC has also developed a comprehensive Automotive Service Package to
complement customers' test coverage and test methodology to reduce the field
failure rate. TSMC Automotive Service Package incorporate tightened process
control, device level screen limit, and wafer sorting scrap criteria,
additional SPC monitoring, preferred tools, etc. It significantly reduces
process variation and outliers.

"Integrated circuits of all types are playing a larger role in the
automotive industry. Our commitment is to support automotive IC technology
including innovations that are taking place in China," said Jason Chen, Vice
President, Worldwide Sales and Marketing, TSMC. "We are backing this
commitment with action by dedicating our efforts at Fab 10 in Shanghai to
accelerate the growth of China's automotive present and future."

TSMC Fab 10 in Shanghai, along with multiple fabs in Taiwan, has
successfully established the capability of supporting the automotive service
package. The automotive process route in Fab 10 is available for global auto
supply chain companies, including those in China.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry's largest portfolio
of process-proven libraries, IP, design tools and reference flows. The
Company's total managed capacity in 2008 exceeded 9 million 8-inch equivalent
wafers, including capacity from two advanced 12-inch - GigaFabs(TM), four
eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned
subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC.
TSMC is the first foundry to provide 40nm production capabilities. Its
corporate headquarters are in Hsinchu, Taiwan. For more information about
TSMC please visit www.tsmc.com.

Ferda Mehmet, A&R Edelman, +1-650-762-2946, Mobile: +1-415-308-7877; or Michael Kramer, Corporate Public Relations, +886-3-5636688 ext: 7126216