TSMC Qualifies New 0.18-Micron Embedded Flash Family

HSIN-CHU, Taiwan, R.O.C. - Ideal for power sensitive, automotive and analog applications

Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330; NYSE: TSM)
today announced that it has qualified its new 0.18-micron embedded flash
(embFlash) process technology family that targets a wide range of
applications. The new family includes a baseline 1.8 to 5 volt standard
process, an ultra-low leakage process, and specific automotive-qualified
embedded Flash IP.

“This extended featured-rich 0.18-micron embedded flash family
demonstrates the emphasis that TSMC places on serving the analog, power
sensitive and automotive markets. The breadth of applications that this
family targets is unprecedented and reflects the growing market demand for
technology that is both broad in scope, yet precise in its application,” said
George Liu, director, Mainstream Technology Business.

The baseline 0.18-micron 1.8V/5V embFlash process supports enhanced
analog performance and traditional 5 volt I/O interface applications. The
true 5 volt I/Os achieve better performance in a smaller footprint than
similar 5 volt I/Os built on higher voltage devices.

The process features a single low voltage Flash IP that operates fully
functions at 1.8 volts. Several Flash IP macros and a customization service
are available now. The new process is ideal for large appliance motor
controls on refrigerators, washing machines and air conditioners.

The TSMC 0.18-micron Ultra-Low-Leakage (uLL) embFlash process operates at
1.8V and features a 95% leakage reduction compared to the baseline process.
Built upon the uLL devices, CPU, standard cell library, and SRAM can save up
to 85%, 90%, and 95% standby current respectively compared to the baseline
process. A low power Flash IP supports up to 80% lower standby current and
60% lower active current with the Flash IP compiler expected to be available
in Q3 this year.

The uLL process is particularly suitable for power-sensitive and portable
devices.

The High-Data-Retention (HDR) member of the 0.18-micron embedded flash
family operates at 1.8V/3.3V and has been qualified for automotive quality
requirement AEC-Q100. Extensive test methodology has also been developed to
meet the stringent automotive ppm requirements in powertrain, security
systems, body systems, and infotainment.

The TSMC’s 0.18-micron process requires only seven mask layers to
implement the embedded flash features and is now ready for production in
Fab 3.

About TSMC

TSMC is the world’s largest dedicated semiconductor foundry, providing
the industry’s leading process technology and the foundry’s largest portfolio
of process-proven libraries, IP, design tools and reference flows. The
Company’s total managed capacity in 2008 exceeded 9 million (8-inch
equivalent) wafers, including capacity from two advanced 12-inch - GigaFabs
(TM), four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned
subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC.
TSMC is the first foundry to provide 40nm production capabilities. Its
corporate headquarters are in Hsinchu, Taiwan. For more information about
TSMC please visit www.tsmc.com.

Source: TSMC

Wendy Matthews of TSMC North America, +1-408-382-8030, or JH Tzeng, Corporate Public Relations, +886-3-666-5028