Qualcomm and TSMC Collaborating on 28nm Process Technology

Cutting-edge Semiconductor Technology Enables Mobile Devices to Offer Greater Functionality and Lower Power Consumption -

SAN DIEGO and HSINCHU, TAIWAN, R.O.C., January 8 - Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator
of advanced wireless technologies, products and services, today announced
that the Company is working closely with foundry partner Taiwan Semiconductor
Manufacturing Company (TWSE: 2330, NYSE: TSM) on 28 nanometer (nm) process
technology. The advanced process node enables more features to be integrated
into smaller chips with a high level of cost efficiency, accelerating the
expansion of wireless into new market segments.

Small form factor and low power consumption are important features of
Qualcomm's next generation of system-on-a-chip (SoC) solutions, including the
Snapdragon(TM) chipset platform. The two companies are capitalizing on their
long-term relationship as Qualcomm works on migrating directly from the 45nm
to the 28nm node.

"TSMC prides itself on its ability to deliver cutting-edge technology
platforms, including the related design ecosystems. Our 28nm platform
supports the high-performance, low-power products that deliver
next-generation experiences," said Jason Chen, vice president of Worldwide
Sales and Marketing. "We are pleased to be working with Qualcomm, a market
leader in wireless technology, on bringing these new experiences to reality."

"Qualcomm's close collaboration with TSMC has always been a key part of
our ability to deliver significant advantages to our customers through the
industry-leading integration, power efficiency and cost efficiency of our
products - enabling them to do more with less," said Jim Clifford, senior
vice president and general manager of Qualcomm CDMA Technologies. "Qualcomm's
integrated fabless manufacturing model and migration to smaller geometries
will allow us to continue enabling the best mobile user experience possible
on handsets, smartphones and smartbook devices."

Qualcomm and TSMC worked closely on 65nm and 45nm technologies. They are
continuing their relationship into low-power, low-leakage 28nm designs for
high-volume manufacturing. Delivering up to twice the density of previous
manufacturing nodes, 28nm technology allows semiconductors that power mobile
devices to do far more with less power. Qualcomm and TSMC are working on both
high-k metal gate (HKMG) 28HP and silicon oxynitride (SiON) 28LP
technologies. Qualcomm expects to tape out its first commercial 28nm products
in mid-2010.

Close collaboration with strategic technology and foundry partners is a
key part of Qualcomm's Integrated Fabless Manufacturing (IFM) business model,
which delivers greater efficiencies and accelerated technology advancement to
the industry.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry's largest portfolio
of process-proven libraries, IP, design tools and reference flows. The
Company's total managed capacity in 2009 exceeded 10 million 8-inch
equivalent wafers, including capacity from two advanced 12-inch -
GigaFabs(TM), four eight-inch fabs, one six-inch fab, as well as TSMC's
wholly owned subsidiaries, WaferTech and TSMC (China), and its joint venture
fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities.
Its corporate headquarters are in Hsinchu, Taiwan. For more information about
TSMC please visit www.tsmc.com.

About Qualcomm

Qualcomm Incorporated (Nasdaq: QCOM) is a leader in developing and
delivering innovative digital wireless communications products and services
based on CDMA and other advanced technologies. Headquartered in San Diego,
Calif., Qualcomm is included in the S&P 100 Index, the S&P 500 Index and is a
2009 FORTUNE 500 company. For more information, please visit Qualcomm around
the Web:

    www.qualcomm.com
    Blog: www.qualcomm.com/blog
    Twitter: www.twitter.com/qualcomm
    Facebook: www.facebook.com/Qualcomm

Qualcomm is a registered trademark of Qualcomm Incorporated. CDMA2000 is
a registered trademark of the Telecommunications Industry Association (TIA
USA). All other trademarks are the property of their respective owners.

Kira Golin, Qualcomm CDMA Technologies, +1-858-651-1554, qctpublicrelations at qualcomm.com, or Emily Kilpatrick, Corporate Communications, +1-858-845-5959, corpcomm at qualcomm.com, or Warren Kneeshaw, Investor Relations, +1-858-658-4813, ir at qualcomm.com, all of Qualcomm; or Ferda Mehmet of A&R Edelman, +1-650-762-2946, Mobile, +1-415-308-7877, for TSMC; or Michael Kramer of TSMC, +886-3-5636688 ext: 7126216, pdkramer at tsmc.com