Qualcomm Announces Chipset with Support for Next-generation Release 9 HSPA+

By Qualcomm Incorporated, PRNE
Sunday, February 13, 2011

MDM8225 Chipset to Support HSPA+ Release 9 Data Rates of up to 84 Mbps -

BARCELONA, Spain, February 14, 2011 - Qualcomm Incorporated (Nasdaq: QCOM) today introduced its newest Mobile
Data Modem(TM) (MDM(TM)) chipset for use in mobile broadband data devices,
the MDM8225(TM). This new MDM will support HSPA+ Release 9, the latest
version of the popular mobile broadband standard, which incorporates
technology enhancements that help the chipset deliver data rates of up to 84
Mbps on the downlink. The MDM8225 will be fabricated using the 28nm
technology node.

"Dual-carrier HSPA+ has proven to be a popular standard with mobile
network operators who are now looking to improve their wireless networks'
performance by adopting the latest version of the technology," said Cristiano
, senior vice president of product management for Qualcomm. "Qualcomm's
new chipset will allow device OEMs to develop high-performance, low-power and
small-form factor devices, such as USB modems or portable WiFi hotspots that
take advantage of the higher data rates provided by HSPA+ Release 9. We are
excited to be working with T-Mobile USA to deliver 84 Mbps HSPA+ capability
in 2012 with the MDM8225."

"Qualcomm is one of T-Mobile's key strategic partners that supports our
ongoing drive to take the HSPA+ ecosystem to 84 Mbps and beyond," said
Neville Ray, chief technology officer, T-Mobile USA. "We look forward to
continuing to work with Qualcomm to stay at the forefront of wireless
innovation with new and compelling 4G devices and services."

The new chipsets will support HSPA+ MIMO antenna technology
simultaneously with HSDPA carrier aggregation on the downlink to deliver
higher data rates to users. The dual-carrier HSDPA feature will also support
aggregation of carriers from different frequency bands and will give network
operators greater flexibility in the use of their allocated radio spectrum to
deliver doubled data rates for faster mobile broadband connectivity.
Additionally, MDM8225 will support dual-carrier HSUPA operation to double
uplink user data rates. The MDM8225 chipsets will support the latest Qualcomm
Interference Cancellation & Equalization (Q-ICE) receiver, a feature that
removes interference in a cellular network to increase network capacity and
enhance the mobile broadband user experience.

The new chipsets will integrate a dedicated processor that will allow
OEMs to develop new product classes and services at a lower cost. For
example, OEMs will be able to develop WiFi hotspot products without requiring
an external application processor. The MDM8225 will pair up with the WTR1605
radio frequency IC and PM8018 power management IC to provide a highly
integrated chipset solution.

The MDM8225 chipset will support all major 3GPP radio bands, including
the 1800 MHz band. As operators plan to refarm their 1800 MHz spectrum to
provide for additional data capacity, the MDM8225 will add to Qualcomm's
family chipsets that will support HSPA+ in the 1800 MHz band.

Samples of the MDM8225 are anticipated to be available in Q4 2011.

About Qualcomm

Qualcomm Incorporated (NASDAQ: QCOM) is a world leader in 3G and
next-generation mobile technologies. For 25 years, Qualcomm ideas and
inventions have driven the evolution of wireless communications, connecting
people more closely to information, entertainment and each other. Today,
Qualcomm technologies are powering the convergence of mobile communications
and consumer electronics, making wireless devices and services more personal,
affordable and accessible to people everywhere. For more information, visit
Qualcomm around the Web:


    Corporate Blog: www.qualcomm.com/blog
    Twitter: www.twitter.com/qualcomm
    Facebook: www.facebook.com/qualcomm

Except for the historical information contained herein, this news release
contains forward-looking statements that are subject to risks and
uncertainties, including the Company's ability to successfully design and
have manufactured significant quantities of MSM8225 on a timely and
profitable basis, the extent and speed to which HSPA+ Release 9 is deployed,
change in economic conditions of the various markets the Company serves, as
well as the other risks detailed from time to time in the Company's SEC
reports, including the report on Form 10-K for the year ended September 26,
, and most recent Form 10-Q.

Qualcomm is a registered trademark of Qualcomm Incorporated. Mobile Data
Modem, MDM and MSM8225 are trademarks of Qualcomm Incorporated. All other
trademarks are the property of their respective owners.

    Qualcomm Contacts:
    Tina Asmar, Corporate Communications
    Phone: +1-858-845-5959
    Email: corpcomm@qualcomm.com

    Warren Kneeshaw, Investor Relations
    Phone: +1-858-658-4813
    Email: ir@qualcomm.com

Tina Asmar, Corporate Communications, +1-858-845-5959, corpcomm at qualcomm.com, or Warren Kneeshaw, Investor Relations, +1-858-658-4813, ir at qualcomm.com, both of Qualcomm Incorporated

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