Qualcomm Delivers a Faster Mobile Broadband Experience with New, Higher Speed LTE Devices

By Qualcomm Incorporated, PRNE
Sunday, February 13, 2011

MDM9625 and MDM9225 Chipsets to Support LTE Data Rates of up to 150 Mbps -

BARCELONA, Spain, February 14, 2011 - Qualcomm Incorporated (Nasdaq: QCOM) today introduced its newest Mobile
Data Modem(TM) (MDM(TM)) chipsets, the MDM9625(TM) and MDM9225(TM), for use
in mobile broadband data devices. These new MDM chipsets will support the LTE
FDD and LTE TDD UE Category 4 mobile broadband standards, which offer peak
downlink data rates of up to 150 Mbps and will be fabricated using the 28nm
technology node. The chipsets also are backwards compatible with previous
generations of LTE and other wireless broadband standards, giving consumers
using USB modems powered by the MDM9625 or MDM9225 chipsets an uninterrupted
broadband data connection on nearly any network around the world. This
announcement in combination with Qualcomm's additional announcement today of
the MDM8225(TM) chipset, which supports HSPA+ Release 9, are the latest
examples of Qualcomm's ongoing leadership in the development of new mobile
broadband modem technologies.

The new chipsets will support LTE Category 4, offering up to 150 Mbps
downlink data rates and 50 Mbps uplink data rates. Other standards supported
by the MDM9625 chipset include HSPA+ Release 9, EV-DO Revision B, EV-DO
Advanced and TD-SCDMA, while the MDM9225 chipset supports HSPA+ Release 9 and
TD-SCDMA. In areas without LTE coverage, the chipsets will fall back on these
other standards. The MDM9625 and MDM9225 chipset also support the latest
Qualcomm Interference Cancellation & Equalization (Q-ICE) receiver, which
reduces interference in a cellular network and increases network capacity to
enhance the mobile broadband user experience. These chipsets are pin
compatible, allowing OEMs to develop different tiers of products with low R&D

"Demand for mobile data connectivity continues to grow among consumers,
and operators are constantly striving to offer faster broadband technologies
on their networks," said Cristiano Amon, senior vice president of product
management for Qualcomm. "Our MDM chipsets, like the MDM9625 and MDM9225,
have been designed to support new mobile broadband standards while remaining
compatible with previous ones, allowing consumers on-the-go access to their
work or entertainment without the concern of network compatibility."

The MDM9625 and MDM9225 chipsets can be used with Qualcomm's WTR1605
radio frequency IC and PM8018 power management ICs to create a
highly-integrated mobile broadband solution. Samples of the MDM9625 and
MDM9225 chipsets are anticipated to be available in Q4 2011.

About Qualcomm

Qualcomm Incorporated (NASDAQ: QCOM) is a world leader in 3G and
next-generation mobile technologies. For 25 years, Qualcomm ideas and
inventions have driven the evolution of wireless communications, connecting
people more closely to information, entertainment and each other. Today,
Qualcomm technologies are powering the convergence of mobile communications
and consumer electronics, making wireless devices and services more personal,
affordable and accessible to people everywhere. For more information, visit
Qualcomm around the Web:


    Corporate Blog: www.qualcomm.com/blog
    Twitter: www.twitter.com/qualcomm
    Facebook: www.facebook.com/qualcomm

Except for the historical information contained herein, this news release
contains forward-looking statements that are subject to risks and
uncertainties, including the Company's ability to successfully design and
have manufactured significant quantities of MDM9625 and MDM9225 chipsets on a
timely and profitable basis, the extent and speed to which networks utilizing
the LTE FDD and LTE TDD UE Category 4 mobile broadband standards are
deployed, change in economic conditions of the various markets the Company
serves, as well as the other risks detailed from time to time in the
Company's SEC reports, including the report on Form 10-K for the year ended
September 26, 2010, and most recent Form 10-Q.

Qualcomm is a registered trademark of Qualcomm Incorporated. MDM9625,
MDM9225 and MDM8225 are trademarks of Qualcomm Incorporated. All other
trademarks are the property of their respective owners.

    Qualcomm Contacts:
    Tina Asmar, Corporate Communications
    Phone: +1-858-845-5959
    Email: corpcomm@qualcomm.com

    Warren Kneeshaw, Investor Relations
    Phone: +1-858-658-4813
    Email: ir@qualcomm.com

Tina Asmar, Corporate Communications, +1-858-845-5959, corpcomm at qualcomm.com, or Warren Kneeshaw, Investor Relations, +1-858-658-4813, ir at qualcomm.com, both of Qualcomm Incorporated

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