Qualcomm Announces Commercial Availability of Gobi3000 Modules

BARCELONA, Spain, February 14, 2011 - — Third Generation Gobi Module Extends Wireless Leadership to Multiple
Forms of Connected Devices –

Qualcomm Incorporated (Nasdaq: QCOM) today announced the next-generation
embedded Gobi3000(TM) certified reference design to help meet the rising
demand for connected mobile devices. This solution will help continue the
growth of the Gobi platform with a combination of performance and flexibility
enhancements and expanded engineering resources.

The new Gobi3000 module design is intended to deliver improved
performance by doubling the HSPA downlink speed and enhancing the Gobi common
application programming interface (API) functionality for enterprise
applications. The design allows Qualcomm's customers to offer both
single-mode (UMTS) and multi-mode designs (CDMA/UMTS). Gobi3000-based
modules, along with enhanced system integration and differentiated software
solutions, are now available from Huawei, Novatel Wireless, Option, Sierra
Wireless and ZTE.

"Today's announcement is a great step forward in making our Gobi platform
more accessible to our customers, more cost competitive and more open than it
has ever been," said Fram Akiki, senior director of product management at
Qualcomm CDMA Technologies. "We are excited to work with the ecosystem to
take Gobi3000-based solutions to market and help our customers reduce
integration and certification expenses, logistics and time to market for new
devices. With the Gobi solution currently available in more than 100
different devices, we believe that the Gobi platform will continue to be an
attractive connectivity solution for any type of connected device."

"The Gobi mobile Internet modules have brought WAN connectivity to many
of our laptop computing solutions," said Kirk Schell, marketing director,
Business Client Products at Dell. "We look forward to giving our customers an
even faster mobile Internet experience by offering the Gobi3000 solution in
our Latitude product lines."

"We've used Qualcomm's Gobi mobile Internet connectivity solutions on
many of our ThinkPad laptops to give our customers wireless 3G connectivity
that keeps them connected almost anywhere they go," said Dilip Bhatia, vice
president, ThinkPad Marketing, Lenovo. "By integrating a Gobi3000-based
module into upcoming ThinkPad laptops, we'll continue to provide users with
an even faster, easy-to-use connectivity solution for an untethered,
productive user experience."

"As a leading innovator in the consumer electronics industry, our choice
for 3G connectivity for VAIO is Gobi technology," said Ryosuke Akahane,
deputy president of VAIO & Mobile Business Group, Sony Corporation. "We are
pleased to be working with Qualcomm to expand the market for connected
consumer devices, while reaping the benefits of having a consistent software
platform across our wireless products."

"We are excited to work with Qualcomm closely to take Gobi3000-based
solutions to our customers," said Mr. Su Jie, director of Huawei MBB Product
Line. "As the global leader of MBB, Huawei Device has established close and
cooperative relationships with operators and PC vendors worldwide.
Integrating the strong chipset platforming ability of Qualcomm with
customized product capability, we believe the Gobi solution will bring more
value to our customers globally."

"Novatel Wireless is proud to be working with Qualcomm's Gobi3000
reference design with multiple OEM platform implementations," says Rob
Hadley, chief marketing officer, Novatel Wireless. "The combination of the
improved performance of Gobi3000-based modules and our leading RF expertise,
integration and platform certification services and software support,
provides OEMs with a simple and cost-effective solution to add connectivity
to any mobile device."

"Option has been a Gobi module provider from the beginning so we have
built up quite some experience and expertise on this platform," said Bernard
Schaballie, vice president of engineering at Option. "We are very pleased
with the latest generation of Gobi-based products as it offers an impressive
price-to-performance ratio. As a Gobi design licensee, we have made our own
LGA and half-size, Gobi-based variants which we are currently offering to our
customers."

"We are pleased to extend our longstanding relationship with Qualcomm and
our PC OEM customers to provide Gobi3000-based solutions," said Dan Schieler,
senior vice president and general manager, Mobile Computing for Sierra
Wireless. "The Gobi platform allows our customers to offer compelling,
flexible solutions that help enterprise IT departments to streamline their
procurement and support requirements."

"ZTE has long been committed to bringing innovative and high-quality
products to its customers worldwide," said Adam Zhang, general manager, MBB
Product Line at ZTE Corporation. "As a long-term licensee of Qualcomm's
technology and a worldwide leader of mobile broadband terminals, we are
pleased to work with Qualcomm to develop and commercialize Gobi3000-based
modules. Our engineering expertise and unparalleled experience with MBB
terminal design and development and global carrier certifications will
continue to give us an advantage in developing leading-edge, Gobi3000-based
modules for a wide portfolio of wireless terminals, including tablets,
eReaders and machine-to-machine products."

The Gobi3000 reference design is based on Qualcomm's MDM6200(TM) and
MDM6600(TM) chipsets, both of which can provide support for HSPA+ data rates
of up to 14.4 Mbps. The MDM6600 also supports CDMA2000(R) 1xEV-DO Rev. A and
Rev. B. For more information about Gobi technology, please visit
www.gobianywhere.com

About Qualcomm

Qualcomm Incorporated (NASDAQ: QCOM) is a world leader in 3G and
next-generation mobile technologies. For 25 years, Qualcomm ideas and
inventions have driven the evolution of wireless communications, connecting
people more closely to information, entertainment and each other. Today,
Qualcomm technologies are powering the convergence of mobile communications
and consumer electronics, making wireless devices and services more personal,
affordable and accessible to people everywhere. For more information, visit
Qualcomm around the Web:

www.qualcomm.com

Corporate Blog: www.qualcomm.com/blog

Twitter: www.twitter.com/qualcomm

Facebook: www.facebook.com/qualcomm

Except for the historical information contained herein, this news release
contains forward-looking statements that are subject to risks and
uncertainties, including the Company's ability to successfully design and
have manufactured significant quantities of MDM6200, MDM6600 and CDMA
components on a timely and profitable basis, the extent and speed to which
the Gobi3000 module is adopted, change in economic conditions of the various
markets the Company serves, as well as the other risks detailed from time to
time in the Company's SEC reports, including the report on Form 10-K for the
year ended September 26, 2010, and most recent Form 10-Q.

Qualcomm is a registered trademark of Qualcomm Incorporated. CDMA2000 is
a registered trademark of the Telecommunications Industry Association (TIA
USA). Gobi3000, MDM6200 and MDM660 are trademarks of Qualcomm Incorporated.
All other trademarks are the property of their respective owners.

    Qualcomm Contacts:
    Tina Asmar, Corporate Communications
    Phone: +1-858-651-1923
    Email: corpcomm@qualcomm.com

    Warren Kneeshaw, Investor Relations
    Phone: +1-858-658-4813
    Email: ir@qualcomm.com

Qualcomm Contacts: Tina Asmar, Corporate Communications, +1-858-651-1923, corpcomm at qualcomm.com, or Warren Kneeshaw, Investor Relations, +1-858-658-4813, ir at qualcomm.com