Icera Announces First 4G LTE / 3G / 2G Multimode Platform & Higher Performance HSPA+ Platform

New Livanto(R) ICE8060 40nm Soft Baseband Delivers Smallest Form Factor & Full Performance Multimode LTE/HSPA+ - Key Selling Points for Mobile Broadband & Smartphone Customers

BRISTOL, England, October 19, 2010 - Icera Inc., the software-defined semiconductor company, today announced
availability of two platforms for multimode LTE and HSPA+ based on its new
40nm Livanto(R) ICE8060 and ICE8061 soft baseband processors. Icera maintains
its leading edge HSPA+ and LTE roadmap advantage and continues to deliver the
industry's smallest solutions, due to its unique software-defined modem
architecture.

Espresso(R)410 (based on ICE8061 baseband and ICE8261radio) is the first
Icera platform to add 4G LTE in software to its high speed multimode HSPA+ /
3G / 2G technology, offering peak data rates of 50Mbps in up to 10MHz
spectrum. In early 2011, Icera will offer an upgrade to add 2G/3G voice, with
4G circuit-switch fall-back (CSFB) integration and a Radio Interface Layer
(RIL) for Google's Android(TM) operating system, enabling customers to build
high performance LTE smartphones as well as tablets and mobile broadband USB
sticks.

Espresso(R)400 (based on ICE8060 baseband and Icera's proven ICE8260
radio) initially supports 21Mbps HSPA+, scaling to 42Mbps and beyond,
delivering the fastest user experience and best network optimization of any
HSPA+ chipset in real world conditions. The new platform also integrates a
USB port and an SDxC controller, reducing the modem bill of materials and
enabling even smaller and more cost effective mobile broadband devices.

Steve Allpress, CTO & VP Modem Software, Icera Inc., said:
"Our soft modem architecture is an LTE game-changer, enabling early multimode
LTE devices that are comparable with current HSPA devices in terms of form
factor, power and cost. Icera's software-defined modem approach is leading
once again with performance and early availability of the latest air
interfaces."

Icera's new ICE8060 and ICE8061 soft baseband processors are leading the
industry in small form factor, cost-effective and energy-efficient modem
chipsets for devices that operate on tomorrow's networks. Scaleable up to
1.3GHz at low supply voltages, these devices deliver 3x the algorithmic
computational power of Icera's current 65nm generation. Available in 8×8 BGA
packages, they are the first in a new generation of 40nm DXP(R) based chips
which run all the 4G/3G/2G modem physical layer, protocol stack, drivers,
voice codecs, echo cancellation, noise reduction and equalization in software
on a single small die. The ICE8261 RF transceiver chip is offered in a 7×7
BGA package and is Icera's first LTE/HSPA+/EDGE radio chip supporting LTE in
US bands 4 and 17, in European Digital Dividend bands and in Japan's
band 1.

Icera is currently engaged with multiple customers who are developing
products based on the Espresso(R)400 and Espresso(R)410 platforms, which are
expected to reach the market in early 2011.

About Icera

Icera is a fabless semiconductor company, pioneering software-defined
modem chipsets for the fast growing smartphone and Mobile Broadband device
markets. Icera technology delivers the highest performance modem solutions
with the smallest silicon die size for USB dongles, tablets and smartphones.
Icera technology supports 4G (LTE), 3G (HSPA) and 2G standards. Founded in
2002, Icera is headquartered in the UK, with design locations in the UK,
France, USA and China, with customer engineering and sales offices in Europe,
Asia and the USA. For more information, visit the Icera web site at
www.icerasemi.com.

For further information, please contact: Sally Doherty, Icera Inc., Tel: +44-1454-284800, Email: sally at icerasemi.com