Qualcomm Introduces 28nm Mass Market LTE/DC-HSPA+ Chipsets for Mobile Broadband Products

MDM9615 to Support Multi-Mode LTE and MDM8215 to Support Dual-Carrier HSPA+

BARCELONA, Spain, February 14, 2011 - Qualcomm Incorporated (Nasdaq: QCOM) today announced two new devices in
its family of Mobile Data Modem(TM) (MDM(TM)) chipsets, the MDM9615(TM) and
MDM8215(TM). The next generation MDM9615 will support LTE (FDD and TDD),
DC-HSPA+, EV-DO Rev-B and TD-SCDMA and the MDM8215 will support DC-HSPA+.
These chipsets will be fabricated using the 28nm technology node and are
anticipated to further drive broadband data products into the mass market on
3G and 4G networks, worldwide.

"As networks evolve to support faster wireless technologies, device OEMs
will need to quickly and cost efficiently develop new mobile wireless
broadband data products that support these emerging technologies," said
Cristiano Amon, senior vice president of product management at Qualcomm CDMA
Technologies. "Qualcomm's MDM9615 and MDM8215 chipset's comprehensive RF band
support, pin compatibility and common software baseline will enable OEMs to
develop multi-mode LTE or DC-HSPA+ device variants with minimal development
costs across their worldwide customer base."

The MDM9615 and MDM8215 chipsets will be highly-optimized follow-on
products to the MDM9600(TM) and MDM8220(TM) product family. Both chipsets
will provide enhancements in modem performance, power consumption, board area
and BOM expense. For example, the new chipsets will feature a dedicated
processor that will allow OEMs to differentiate their products through the
addition of value added services, and they will be able to develop Wi-Fi
hotspot products without requiring an external application processor. Both
chipsets will be compatible with Qualcomm's Power Optimized Envelope Tracking
(Q-POET) solution that provides further power consumption and thermal
improvements allowing for smaller device form factors.

These chips will also offer best-in-class modem performance by
incorporating the latest version of Qualcomm's Interference Cancellation &
Equalization (Q-ICE) algorithm - leading to higher user data throughputs and
increased network capacity. In addition to LTE TDD, the MSM9615 will also
support TD-SCDMA, making it an optimized chipset solution well-suited for the
Chinese mobile broadband market.

The MDM9615 and MDM8215 are designed to pair up with the WTR1605 radio
frequency IC and PM8018 power management IC to provide a highly integrated
chipset solution. The WTR1605 will be Qualcomm's first Radio Transceiver in
Wafer Level Package and will be a highly integrated radio transceiver with
multi-mode (LTE FDD, LTE TDD, CDMA, WCDMA, TD-SCDMA, GSM) and multi-band
support. The WTR1605 will be optimized for low power consumption and small
footprint and will integrate a high performance GPS core with GLONASS
support. Samples of the MDM9615, MDM8215, WTR1605 and PM8018 are anticipated
to be available in late 2011.

About Qualcomm

Qualcomm Incorporated (NASDAQ: QCOM) is a world leader in 3G and
next-generation mobile technologies. For 25 years, Qualcomm ideas and
inventions have driven the evolution of wireless communications, connecting
people more closely to information, entertainment and each other. Today,
Qualcomm technologies are powering the convergence of mobile communications
and consumer electronics, making wireless devices and services more personal,
affordable and accessible to people everywhere. For more information, visit
Qualcomm around the Web:

www.qualcomm.com

Corporate Blog: www.qualcomm.com/blog

Twitter: www.twitter.com/qualcomm

Facebook: www.facebook.com/qualcomm

Except for the historical information contained herein, this news release
contains forward-looking statements that are subject to risks and
uncertainties, including the Company's ability to successfully design and
have manufactured significant quantities of the MDM9615, MDM8215, WTR1605 and
PM8018 on a timely and profitable basis, the extent and speed to which LTE
(FDD and TDD), DC-HSPA+, EV-DO Rev-B, TD-SCDMA and DC-HSPA+ are deployed,
change in economic conditions of the various markets the Company serves, as
well as the other risks detailed from time to time in the Company's SEC
reports, including the report on Form 10-K for the year ended September 26,
2010, and most recent Form 10-Q.

Qualcomm is a registered trademark of Qualcomm Incorporated. CDMA2000 is
a registered trademark of the Telecommunications Industry Association (TIA
USA). Mobile Data Modem, MDM, MDM9615, MDM8215, MDM9600 and MDM8220 are
trademarks of Qualcomm Incorporated. All other trademarks are the property of
their respective owners.

    Qualcomm Contacts:
    Tina Asmar, Corporate Communications
    Phone: +1-858-651-1923
    Email: corpcomm@qualcomm.com

    Warren Kneeshaw, Investor Relations
    Phone: +1-858-658-4813
    Email: ir@qualcomm.com

Tina Asmar, Corporate Communications, +1-858-651-1923, corpcomm at qualcomm.com, or Warren Kneeshaw, Investor Relations, +1-858-658-4813, ir at qualcomm.com, both of Qualcomm Incorporated